The new code names should also continue in the future. By closed presentation, it was revealed that Intel’s first 7nm generation (the upcoming Meteor Lake) is now called Intel 4. The subsequent refresh is then called Intel 3, which should be available in the second half of 2023.
Under Intel 4, the processor manufacturer wants to use more EUV lithography. This technique is more efficient and potentially increases the drive current of products. With Intel 3, the focus is on strengthening the CPU portfolio with improved High Power
segments on the chip.
Still later in the pipeline, Intel 20A should follow , sometime in the first half of 2024. The ‘A’ here stands for angstrom, a unit of measurement that is down to a tenth of a nanometer. This process therefore appears to have a transistor density of 2nm, built on Intel’s new RibbonFET architecture. Intel has not yet linked an official product line to the Intel 20A generation. In addition, Intel’s Foveros technology will return as Foveros Omni in the future. Under this banner, Intel wants to ‘stack’ chips more efficiently, regardless of different manufacturing processes. The return of Foveros is expected in 2023, together with Foveros Direct, a technique to bind the stacked chips together more efficiently.
